India, July 18 -- JNTC Co. Ltd has unveiled its new Through-Glass-Via (TGV) glass substrate under the theme 'Carving Semiconductors into Glass, the Dream Material.'

Andrew Cho, CEO, introduced the proprietary TGV glass substrate as a breakthrough solution to the limitations of plastic-based substrates. Designed for AI and high-performance computing applications, the substrate offers excellent flatness and thermal stability, which help reduce warpage and heat generation under high-speed processing.

JNTC completed its domestic production line in June and expects to begin full-scale manufacturing in August, following test runs in July. Unlike competitors, JNTC built and engineered most of its core production equipment in-house, enabling co...