India, March 17 -- Just as semiconductor veteran Lip-Bu Tan steps in as Intel's CEO, Intel's 18A node seems to be making early strides. TechPowerUp, citing Intel's engineering manager Pankaj Marria, reports that initial 18A wafers are already rolling out from the Arizona plant.

The progress, according to ijiwei and Commercial Times, implies that Intel's 18A mass production is likely to be pulled forward to mid-year.

Intel originally planned to begin 18A tape-outs in early 2025, with mass production following in the second half of the year.

This is a win for Intel as Tan pushes his foundry-focused vision. In a letter to employees, he pledged to restore Intel as a top chipmaker and build a world-class foundry, as per Reuters.

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