India, Aug. 22 -- izmomicro, a specialized division of izmo Ltd, announced a major milestone in silicon photonics packaging, underscoring its role as a pioneer in India's semiconductor ecosystem, and advancing the country's position in the global race toward next-generation data and AI infrastructure.

izmomicro has developed a high-density silicon photonics packaging platform capable of supporting 32-channel fiber input and output, with an industry-leading insertion loss of less than 2 dB. Achieving this level of density is one of the greatest challenges in the field, demanding nanometer-scale optical alignment, advanced assembly processes, and seamless integration of electronics. The module also incorporates 32 DC I/Os, 4 RF I/Os, and h...