India, Nov. 25 -- IBM and the University of Dayton have announced an agreement for the joint research and development of next-generation semiconductor technologies and materials. The collaboration aims to advance critical technologies for the age of AI, including AI hardware, advanced packaging, and photonics.

To support the collaboration, IBM will contribute state-of-the-art semiconductor equipment to the University of Dayton for a new semiconductor nanofabrication facility on the university's campus. With a planned completion in early 2027, the facility will serve as a hub for advanced semiconductor research and workforce development, providing hands-on, lab-to-fab learning opportunities for University of Dayton students and researcher...