India, May 27 -- TrendForce's latest findings reveal that demand for AI servers continues to accelerate the development of HBM technologies, with the three major suppliers actively advancing their HBM4 product roadmaps.

HBM4 introduces a more complex chip design that expands die size due to a significant increase in I/O count. Additionally, some vendors are also transitioning to a logic-based base die architecture to enhance performance, with both factors contributing to higher production costs. For reference, HBM3e debuted with an estimated 20% price premium; HBM4's elevated manufacturing difficulty is expected to drive premiums above 30%.

Leading AI chipmaker Nvidia unveiled its next-generation Rubin GPU at this year's GTC, while AMD ...