India, Oct. 28 -- Union Electronics and IT Minister, Ashwini Vaishnaw, announced the approval of first trench of 7 projects under the Electronics Components Manufacturing Scheme (ECMS). Nowc, multi-layer printed circuit boards (ML-PCBs), HDI PCBs, camera modules, copper-clad laminates, and polypropylene films will be made in India.

The move marks a major step in India's journey from making finished products to manufacturing modules, components, materials, and machineries used to manufacture them.

The new electronics manufacturing units will meet 100% of copper-clad laminates, 20% of printed circuit boards, and 15% of camera modules demand domestically. 60% of the production will be exported, said Vaishnaw.

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