India, Nov. 10 -- Yole Group's new report, Glass Materials for Advanced Packaging 2025, covers how glass has evolved from a standard wafer carrier to a key piece on the board of next-generation AI engine architectures, with applications ranging from chiplets to co-packaged optics.

As semiconductor chip architectures become more complex and performance-driven, the materials enabling advanced packaging are evolving just as fast. Yole Group's new report, Glass Materials for Advanced Packaging 2025, provides the first in-depth analysis dedicated to the fast-growing glass materials market across multiple packaging platforms, including glass core substrates, glass interposers, glass carriers, TGVs, and glass-based emerging technologies.

Yole ...