India, Dec. 29 -- Gigaphoton Inc., a manufacturer of lightsources for semiconductor lithography, announced that it has delivered an excimer laser for semiconductor advanced packaging to a Japanese company engaged in R&D of advanced semiconductors, and the installation of the system was successfully completed in November 2025.

Gigaphoton has applied its expertise in semiconductor lithography lightsources to develop a lightsource for ultra-fine ablation processing for advanced packaging processes.

The G300K is an excimer laser based on KrF (248nm) wavelength, which is integrated into the processing equipment for semiconductor package substrates. It provides high power, high repetition rate, high reliability with long life modules.

The ex...