India, Oct. 24 -- As AI, HPC, and 5G drive semiconductor innovation, advanced packaging has become the next strategic focus. Yole Group projects the market to exceed $50 billion by 2025, with fan-out panel-level packaging (FOPLP) growing more than 15% annually.

E&R Engineering presented its latest laser and plasma solutions at the recently-held SEMICON Taiwan 2025, covering FOPLP, Through-Silicon Via (TSV), Through-Glass Via (TGV), and plasma dicing. These fully integrated process technologies help customers manage high I/O density, warpage control, and ultra-fine features.

FOPLP solutions

E&R provides a full equipment portfolio, including laser marking, dicing, plasma cleaning, laser debonding, and ABF drilling, supporting panels up t...