India, June 26 -- The performance of modern AI and high-performance computing applications can only be achieved with high-performance semiconductor technology. Advanced packaging enables several processing units to be accommodated on a single chip, which greatly increases the power density.

At productronica-the world's leading trade fair for the development and production of electronics-the industry will meet in Munich from Nov. 18-21, 2025 to discuss the latest trends. The conceptual and technical sponsor of the trade fair is the VDMA Productronic department.

In recent years, silicon scaling has been the route to improved technological performance, but today, this effect can no longer meet the industry's requirements for higher data sp...