India, April 8 -- With SiCarrier stealing the show at SEMICON China, the company has disclosed more details on its product roadmap. The Chinese chip equipment firm claims to have developed lithography machines for 300-mm wafers on 28nm processes and plans to launch an upgraded version compatible with ASML and Applied Materials by 2026, according to anue.

The report, citing SiCarrier's Market Director, Zhao Min, notes that the company has a dedicated team working on making its equipment fully compatible with those currently used by domestic fabs.

Citing SiCarrier's CTO Chen Dong, the report suggests that the company has partnered with several fabs to set up joint labs, and expects to announce its first batch of commercial orders by the f...