India, April 17 -- Ahead of any official chip duties announced by Washington, the China Semiconductor Industry Association advised last Friday that the origin of integrated circuits should be determined by where the wafer is fabricated, whether packaged or not. Under these rules, according to ijiwei, chips fabricated in U.S.-based wafer fabs will now face higher import duties from China.

According to the report, there are four foundries with fabs in the U.S.-TSMC, GlobalFoundries, Tower Semiconductor, and X-Fab--alongside seven IDM players with U.S. fabs: Intel, Texas Instruments, ADI, Micron, NXP, Infineon, and Samsung.

The report suggests that among the 35 major U.S. fabs, Texas Instruments, Intel, Infineon, and NXP lead the IDM pack ...