India, Nov. 4 -- Lithography technology remains one of the core driving forces behind the continuous scaling of integrated circuit (IC) manufacturing.

Recently, a research team led by Prof. Peng Hailin from the College of Chemistry and Molecular Engineering at Peking University, together with collaborators, achieved a major breakthrough by using cryo-electron tomography (cryo-ET) to visualize, for the first time, the in-situ three-dimensional microstructure, interfacial distribution, and entanglement behavior of photoresist molecules in a liquid environment.

This discovery has guided the development of an industrial process that can significantly reduce lithography defects, marking an important step forward for the semiconductor sector....