India, Oct. 8 -- Cadence has announced major advancements in chip design automation and IP, driven by its long-standing relationship with TSMC to develop advanced design infrastructure and accelerate time to market, for AI and HPC customer applications.

Cadence and TSMC have collaborated closely across the spectrum from AI-driven EDA to 3D-ICs to IP and photonics, enabling the world's most advanced semiconductors.

Cadence announced major advancements in chip design automation and IP, driven by its long-standing relationship with TSMC to develop advanced design infrastructure and accelerate time to market, for AI and HPC customer applications.

Cadence and TSMC have worked together on design infrastructure for advanced process nodes, inc...