India, Jan. 12 -- Cadence announced a Chiplet Spec-to-Packaged Parts ecosystem to reduce engineering complexity and accelerate time to market for customers developing chiplets targeting physical AI, data center, and high-performance computing (HPC) applications.

Initial IP partners joining Cadence include Arm, Arteris, eMemory, M31 Technology, Silicon Creations, and Trilinear Technologies, as well as silicon analytics partner proteanTecs. To help reduce risk and streamline customer adoption, Cadence is collaborating with Samsung Foundry to build out a silicon prototype demonstration of the Cadence Physical AI chiplet platform, including pre-integrated partner IP on the Samsung Foundry SF5A process.

Extending their longstanding history ...