India, June 17 -- Applied Materials, Inc. and CEA-Leti announced the next phase of their longstanding collaboration to accelerate innovation in specialty semiconductors. Through an expansion of their joint lab, the organizations plan to develop materials engineering solutions to address emerging infrastructure challenges in AI data centers.

The joint lab is focused on device innovations for chipmakers serving ICAPS markets (IoT, Communications, Automotive, Power and Sensors). These specialty chips are used in a wide range of applications - from industrial automation to electric vehicles - and they play a critical role managing data and power distribution within data centers. Growing resource demands in AI infrastructure have highlighted ...