India, May 5 -- Ansys has announced thermal and multiphysics signoff tool certifications for designs manufactured with Intel 18A process technology. These certifications help ensure functionality and reliability of advanced semiconductor systems for the most demanding applications - including AI chips, graphic processing units (GPUs), and high-performance computing (HPC) products.

Intel Foundry and Ansys have also enabled a comprehensive multiphysics signoff analysis flow for Intel Foundry's EMIB technology used for creating multi-die 3D integrated circuit (3D-IC) systems.

Recognized as industry-leading solutions, RedHawk-SC and Totem deliver speed, accuracy, and capacity to analyze the power integrity and reliability of Intel 18A Ribbo...