India, April 24 -- Through continued collaboration with TSMC, Ansys announced enhanced AI-assisted workflows for radio frequency (RF) design migration and photonic integrated circuits (PICs), and new certifications for its semiconductor solutions.

Together, Ansys and TSMC facilitate optimized 3D integrated circuit (3D-IC) design and accelerate market readiness for AI and high-performance computing (HPC) chip applications. Ansys and TSMC are also extending tool certification for the newly announced N3C technology, based on available N3P design solutions.

A16 EM/IR and thermal certification

RedHawk-SC, RedHawk-SC Electrothermal, and Totem are certified for TSMC's advanced silicon process A16 with Super Power Rail, a best-in-class backsid...