India, Oct. 15 -- Amkor Technology Inc. in collaboration with the Trump Administration, announced the groundbreaking and expanded planned investment of its new state-of-the-art outsourced semiconductor advanced packaging and test campus in Arizona.

The expanded investment includes additional cleanroom space and a second greenfield packaging and test facility, increasing total project investment by more than $5 billion, to a total of $7 billion across two phases. The groundbreaking ceremony brings together government officials, industry leaders, and community stakeholders to celebrate this significant milestone. Amkor's investment supports the broader strategy to strengthen U.S. semiconductor leadership, and will be the first U.S.-based h...