India, Nov. 27 -- TrendForce's latest investigations reveal that the rapid expansion of AI and HPC is increasing the need for heterogeneous integration, positioning advanced packaging as a strategic priority. TSMC's CoWoS platform is currently the leading solution in this area.

However, as CSPs accelerate their in-house ASIC development to accommodate more complex functions, their packaging size requirements are growing substantially. As a result, some CSPs are contemplating a switch from TSMC's CoWoS to Intel's EMIB.

TrendForce notes that CoWoS connects compute logic, memory, and I/O dies via an interposer, which mounts them on a substrate. The technology has expanded to include CoWoS-S, CoWoS-R, and CoWoS-L.

Demand has been strongly ...