India, Sept. 10 -- AGC Inc. has joined the "JOINT3" Consortium to develop next-generation semiconductor packaging.

JOINT3 is a co-creation evaluation framework established by Resonac, with the aim of accelerating the development of materials, equipment, and design tools optimized for panel-level organic interposers through collaboration among material, equipment, and design companies.

JOINT3 brings together global leaders in semiconductor supply chain. Using a prototype line for 515 x 510mm panel-level organic interposers, the consortium promotes the development of materials, equipment, and design tools optimized for panel-level organic interposers.

In recent years, packaging for back-end processes have emerged as a key technology in t...