India, Feb. 4 -- Data centers and HPC servers are expected to grow gradually in the next years. Both applications are strongly driven by AI. Although the traditional server and networking markets have been weak during 2024, AI servers are growing strongly. Analysts at Yole Group recognize a significant opportunity for the growth and adoption of 2.5D/3D packaging technologies. High-end performance packages with 2.5D/3D approaches are used today to package AI processors like GPUs, and AI ASICs, as well as HBM.

Rayane Mazari, Technology & Cost Analyst, Semiconductor Packaging from Yole Group explains:"There is an increased implementation of high-end systems in high-performance computing, networking, artificial intelligence, autonomous drivi...