India, Aug. 27 -- The global advanced chip packaging market is estimated to be valued at USD 50.38 billion in 2025, and is expected to reach USD 79.85 billion by 2032, exhibiting a CAGR of 6.8% from 2025 to 2032.

The advanced chip packaging market is experiencing growth driven by the rising demand for smaller, faster, and more efficient electronic devices. The expansion of high-performance computing, 5G networks, and the Internet of Things (IoT) is further accelerating this trend. Moreover, the increasing adoption of advanced packaging technologies-such as 2.5D and 3D packaging-is expected to significantly contribute to market growth over the forecast period.

Key takeaways

According to Coherent Market Insights (CMI), the global advance...