India, Sept. 10 -- SEMICON Taiwan 2025 will debut in September. With the sharp increase in demand for AI chips and HPC, the global semiconductor industry is ushering in a new generation of advanced packaging.

This year, SEMICON Taiwan will focus on advanced packaging technologies including 3DIC, panel level fanout packaging (FOPLP), chiplets, and common packaging optometry (CPO).

3DICAMA launched

What is even more noteworthy is that the long-prepared SEMI 3DIC Advanced Packaging Manufacturing Alliance (SEMI 3DICAMA) will also be officially launched at this exhibition. SEMI, together with TSMC and ASE Holdings, has established the 3DIC Advanced Manufacturing Alliance with 34 members to overcome advanced packaging bottlenecks.

SEMICON T...