ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,479,316, issued on Nov. 25, was assigned to Lightyear IPCo B.V. (Helmond, Netherlands). "Scalable multi-port converter for solar electric vehic... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,629, issued on Nov. 25, was assigned to JEOL Ltd. (Tokyo). "Specimen processing holder and specimen processing method" was invented by Yosh... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,580, issued on Nov. 25, was assigned to AFC Cable Systems Inc. (New Bedford, Mass.). "Low-profile cable armor" was invented by Peter Lafren... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,484,295, issued on Nov. 25, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Method (and related apparatus) for ... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,481,479, issued on Nov. 25, was assigned to GOOGLE LLC (Mountain View, Calif.). "Identifying co-located devices within a teleconferencing sessi... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,479,128, issued on Nov. 25, was assigned to Siltronic AG (Munich). "Method for producing semiconductor wafers using a wire saw, wire saw, and s... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,481,871, issued on Nov. 25, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea) and Korea Advanced Institute of Science and Tec... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,481,581, issued on Nov. 25, was assigned to MediaTek Inc. (Hsinchu, Taiwan). "Apparatus and method thereof for dram initialization" was invente... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,481,787, issued on Nov. 25, was assigned to PICA GROUP S.P.A. (Milan). "Method for privacy management of multimedia content" was invented by Da... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,801, issued on Nov. 25, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package" was invented by Manho... Read More