US Patent Issued to Siltronic on Nov. 25 for "Method for producing semiconductor wafers using a wire saw, wire saw, and semiconductor wafers made of monocrystalline silicon" (German Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,479,128, issued on Nov. 25, was assigned to Siltronic AG (Munich).

"Method for producing semiconductor wafers using a wire saw, wire saw, and semiconductor wafers made of monocrystalline silicon" was invented by Axel Beyer (Munich) and Stefan Welsch (Polling, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "Semiconductor wafers having a subsurface-referenced nanotopography of the upper side surface of less than 6 nm, expressed as a maximum peak-to-valley distance on a subsurface and referenced to subsurfaces with an area content of 25 mmx25 mm, are produced from a workpiece by feeding the workpiece through a wire web tensioned between wire guide r...