ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,801, issued on Nov. 25, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Semiconductor package" was invented by Manho Lee (Hwaseong-si, South Korea), Keung Beum Kim (Hwaseong-si, South Korea) and Kyung Suk Oh (Seongnam-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a package substrate, a power module on a first surface of the package substrate, a connector on the first surface of the package substrate, the connector being horizontally spaced apart from the power module, a first semiconductor chip on a second surface of the package substrate opposite to the first surface, and a fi...