ALEXANDRIA, Va., June 9 -- United States Patent no. 12,288,660, issued on April 29, was assigned to DEXERIALS Corp. (Tochigi, Japan). "Protective element" was invented by Yoshihiro Yoneda (Shimotsuke... Read More
ALEXANDRIA, Va., June 9 -- United States Patent no. 12,288,660, issued on April 29, was assigned to DEXERIALS Corp. (Tochigi, Japan). "Protective element" was invented by Yoshihiro Yoneda (Shimotsuke... Read More
ALEXANDRIA, Va., June 9 -- United States Patent no. 12,285,978, issued on April 29, was assigned to IRH INC (Orting, Wash.). "Modular integrated tire inflation hub system and device" was invented by ... Read More
ALEXANDRIA, Va., June 9 -- United States Patent no. 12,285,978, issued on April 29, was assigned to IRH INC (Orting, Wash.). "Modular integrated tire inflation hub system and device" was invented by ... Read More
ALEXANDRIA, Va., June 9 -- United States Patent no. 12,289,872, issued on April 29, was assigned to VOLKSWAGEN AG (Wolfsburg, Germany) and University of Tennessee Research Foundation (Knoxville, Tenn.... Read More
ALEXANDRIA, Va., June 9 -- United States Patent no. 12,289,872, issued on April 29, was assigned to VOLKSWAGEN AG (Wolfsburg, Germany) and University of Tennessee Research Foundation (Knoxville, Tenn.... Read More
ALEXANDRIA, Va., June 9 -- United States Patent no. 12,288,134, issued on April 29, was assigned to IONQ INC. (College Park, Md.). "Quantum approximate chaos optimization for use in a hybrid computin... Read More
ALEXANDRIA, Va., June 9 -- United States Patent no. 12,288,134, issued on April 29, was assigned to IONQ INC. (College Park, Md.). "Quantum approximate chaos optimization for use in a hybrid computin... Read More
ALEXANDRIA, Va., June 9 -- United States Patent no. 12,289,885, issued on April 29, was assigned to Tokyo Electron Ltd. (Tokyo). "3D integration of 3D NAND and vertical logic beneath memory" was inve... Read More
ALEXANDRIA, Va., June 9 -- United States Patent no. 12,289,885, issued on April 29, was assigned to Tokyo Electron Ltd. (Tokyo). "3D integration of 3D NAND and vertical logic beneath memory" was inve... Read More