Exclusive

Publication

Byline

INTERNATIONAL PATENT: PREFERRED NETWORKS, INC., 株式会社PREFERRED NETWORKS FILES APPLICATION FOR "INFERENCE DEVICE, TRAINING DEVICE AND INFERENCE METHOD"

GENEVA, July 29 -- PREFERRED NETWORKS, INC. (Otemachi Bldg., 1-6-1, Otemachi, Chiyoda-ku, Tokyo1000004), 株式会社Preferr&#65349... Read More


INTERNATIONAL PATENT: LG ELECTRONICS INC., 엘지전자 주식회사 FILES APPLICATION FOR "ELECTRONIC DEVICE AND CRADLE THEREFOR"

GENEVA, July 29 -- LG ELECTRONICS INC. (128, Yeoui-daero,Yeongdeungpo-guSeoul 07336), 엘지전자 주식회사 (서울특별시&#50689... Read More


INTERNATIONAL PATENT: UNO LABORATORIES, LTD., 株式会社ウーノラボ FILES APPLICATION FOR "CENTRAL PROCESSING UNIT"

GENEVA, July 29 -- UNO LABORATORIES, LTD. (3-8-6-305 Sendagaya, Shibuya-ku, Tokyo1510051), 株式会社ウーノラボ (東京都渋&#3... Read More


INTERNATIONAL PATENT: WORLD WING ENTERPRISE CO., LTD., 株式会社ワールドウィングエンタープライズ FILES APPLICATION FOR "LOAD TRANSMISSION MECHANISM UNIT FOR TRAINING DEVICE AND TRAINING DEVICE USING SAME"

GENEVA, July 29 -- WORLD WING ENTERPRISE CO., LTD. (1-73-3, Minamiyoshikata, Tottori-shi, Tottori6800843), 株式会社ワールドウィン&#124... Read More


INTERNATIONAL PATENT: WAVELORD CO., LTD, 웨이브로드 주식회사 FILES APPLICATION FOR "METHOD FOR MANUFACTURING GROUP III NITRIDE SEMICONDUCTOR TEMPLATE AND GROUP III NITRIDE SEMICONDUCTOR TEMPLATE MANUFACTURED THEREBY"

GENEVA, July 29 -- WAVELORD CO., LTD (411-31, Baran-ro, Hyangnam-eupHwaseong-siGyeonggi-do 18589), 웨이브로드 주식회사 (경기도&#... Read More


INTERNATIONAL PATENT: DAI NIPPON PRINTING CO., LTD., 大日本印刷株式会社 FILES APPLICATION FOR "POWER STORAGE DEVICE AND METHOD FOR MANUFACTURING SAME AND OUTER PACKAGE MATERIAL FOR POWER STORAGE DEVICE AND METHOD FOR MANUFACTURING SAME"

GENEVA, July 29 -- DAI NIPPON PRINTING CO., LTD. (1-1, Ichigaya Kagacho 1-chome, Shinjuku-ku, Tokyo1628001), 大日本印刷株式会社 (東京&... Read More


INTERNATIONAL PATENT: DAIKIN INDUSTRIES, LTD., ダイキン工業株式会社 FILES APPLICATION FOR "POLYMER COMPOSITION, BINDER FOR ELECTROCHEMICAL DEVICE, ELECTRODE MIXTURE, ELECTRODE AND SECONDARY BATTERY"

GENEVA, July 29 -- DAIKIN INDUSTRIES, LTD. (Osaka Umeda Twin Towers South, 1-13-1, Umeda, Kita-ku, Osaka-Shi, Osaka5300001), ダイキン工業株式会&#3... Read More


INTERNATIONAL PATENT: NIPRO CORPORATION, ニプロ株式会社 FILES APPLICATION FOR "PUNCTURE NEEDLE FOR PERFORATION"

GENEVA, July 29 -- NIPRO CORPORATION (3-26, Senriokashinmachi, Settsu-shi, Osaka5668510), ニプロ株式会社 (大阪府摂津市&#21... Read More


INTERNATIONAL PATENT: TAKAOKA TOKO CO., LTD., 株式会社東光高岳 FILES APPLICATION FOR "EXTERNAL APPEARANCE INSPECTION APPARATUS"

GENEVA, July 29 -- TAKAOKA TOKO CO., LTD. (6-36, Toyosu 5-chome, Koto-ku, Tokyo1350061), 株式会社東光高岳 (東京都江東&#213... Read More


INTERNATIONAL PATENT: POLYPLASTICS CO., LTD., ポリプラスチックス株式会社 FILES APPLICATION FOR "COMPOSITE MOLDED ARTICLE AND RESIN COMPOSITION"

GENEVA, July 29 -- POLYPLASTICS CO., LTD. (2-18-1, Konan, Minato-ku, Tokyo1088280), ポリプラスチックス株式会社 (東&#... Read More