ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,542,438, issued on Feb. 3, was assigned to Enphase Energy Inc. (Petaluma, Calif.). "Integrated PCBA design with fast connection-disconnection ca... Read More
ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,542,005, issued on Feb. 3, was assigned to Enterprise Holdings Inc. (St. Louis). "Rental/car-share vehicle access and management system and meth... Read More
ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,541,168, issued on Feb. 3, was assigned to KYOCERA Document Solutions Inc. (Osaka, Japan). "Image forming apparatus" was invented by Yuta Ikeda ... Read More
ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,543,350, issued on Feb. 3, was assigned to CHANGXIN MEMORY TECHNOLOGIES INC. (Hefei, China). "Semiconductor structure and method for fabricating... Read More
ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,542,984, issued on Feb. 3, was assigned to Intel Corp. (Santa Clara, Calif.). "Method and apparatus to use a passive optical network to communic... Read More
ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,539,298, issued on Feb. 3. "Lobinaline N-oxides as positive allosteric modulators of the dopamine transporter with potential value in the treatm... Read More
ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,542,855, issued on Feb. 3, was assigned to Zoom Communications Inc. (San Jose, Calif.). "Split-mode conference access" was invented by Karen Kue... Read More
ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,540,849, issued on Feb. 3, was assigned to Buchi Labortechnik AG (Flawil, Switzerland). "Handheld optical spectroscopy scanner" was invented by ... Read More
ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,542,207, issued on Feb. 3, was assigned to OSF Healthcare System (Peoria, Ill.). "Computing technologies for operating user interfaces based on ... Read More
ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,543,526, issued on Feb. 3, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING Co. LTD. (Hsinchu, Taiwan). "Fully automated wafer debonding syste... Read More