US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Feb. 3 for "Fully automated wafer debonding system and method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,543,526, issued on Feb. 3, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING Co. LTD. (Hsinchu, Taiwan).

"Fully automated wafer debonding system and method thereof" was invented by Cheng-Fei Yu (Hsin-Chu, Taiwan), Chang-Chen Tsao (Hsin-Chu, Taiwan), Ting-Yau Shiu (Hsin-Chu, Taiwan), Cheng-Kang Hu (Kaohsiung, Taiwan), Hsu-Shui Liu (Pingjhen, Taiwan) and Jiun-Rong Pai (Jhubei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus and method for debonding a pair of bonded wafers are disclosed herein. In some embodiments, the debonding apparatus, comprises: a wafer chuck having a preset maximum lateral dimension and configured to rotate the pai...