ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,473,274, issued on Nov. 18, was assigned to ALCHEMEDICINE INC. (Ibaraki, Japan). "Heterocyclic compound as inhibitor of casein kinase 1-Delta a... Read More
ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,474,208, issued on Nov. 18, was assigned to KARL STORZ Imaging Inc. (Goleta, Calif.). "Imaging spectrometer and camera with sliding lens group"... Read More
ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,475,565, issued on Nov. 18, was assigned to ADOBE INC. (San Jose, Calif.). "Amodal instance segmentation using diffusion models" was invented b... Read More
ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,475,676, issued on Nov. 18, was assigned to KONICA MINOLTA INC. (Tokyo). "Object detection method, object detection device, and program" was in... Read More
ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,433, issued on Nov. 18, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan). "Light-emitting element array" was invented b... Read More
ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,472,635, issued on Nov. 18, was assigned to OMRON Corp. (Kyoto, Japan). "Control device, robot, control method, and program" was invented by No... Read More
ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,477,509, issued on Nov. 18, was assigned to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT Co. LTD. (Osaka, Japan). "Wireless communication system,... Read More
ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,472,676, issued on Nov. 18, was assigned to GUANGZHOU TECH-LONG PACKAGING MACHINERY Co. LTD (Guangdong, China). "Heat treatment device for pet ... Read More
ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,477,758, issued on Nov. 18, was assigned to MURATA MANUFACTURING Co. LTD. (Nagaokakyo, Japan). "Semiconductor structure enhanced for high volta... Read More
ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,213, issued on Nov. 18, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor package and method of... Read More