US Patent Issued to QUALCOMM on Dec. 23 for "Flexible metadata regions for a memory device" (California Inventors)

ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,504,876, issued on Dec. 23, was assigned to QUALCOMM Inc. (San Diego). "Flexible metadata regions for a memory device" was invented by Jungwon ... Read More

US Patent Issued to Tokyo Electron on Dec. 23 for "Substrate processing apparatus and substrate processing method" (Japanese Inventors)

ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,503,763, issued on Dec. 23, was assigned to Tokyo Electron Ltd. (Tokyo). "Substrate processing apparatus and substrate processing method" was i... Read More

US Patent Issued to Telefonaktiebolaget LM Ericsson on Dec. 23 for "Configuration of QoE measurements and associated measurement duration time supporting mobility" (Swedish, Italian, Spanish Inventors)

ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,507,103, issued on Dec. 23, was assigned to Telefonaktiebolaget LM Ericsson (publ) (Stockholm). "Configuration of QoE measurements and associat... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on Dec. 23 for "Semiconductor processing tool and methods of operation" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,503,769, issued on Dec. 23, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor processing tool and m... Read More

US Patent Issued to Huawei Technologies on Dec. 23 for "Communication method and sidelink device" (Chinese Inventor)

ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,507,299, issued on Dec. 23, was assigned to Huawei Technologies Co. Ltd. (Shenzhen, China). "Communication method and sidelink device" was inve... Read More

US Patent Issued to paymentinApp on Dec. 23 for "Distributed processing method and apparatus interacting with client" (South Korean Inventor)

ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,505,672, issued on Dec. 23, was assigned to paymentinApp Inc. (Seoul, South Korea). "Distributed processing method and apparatus interacting wi... Read More

US Patent Issued to GlobalFoundries Singapore on Dec. 23 for "Face bonded semiconductor device with through oxide via and metal plug" (Singaporean, Malaysian Inventors)

ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,506,050, issued on Dec. 23, was assigned to GlobalFoundries Singapore Pte. Ltd. (Singapore). "Face bonded semiconductor device with through oxi... Read More

US Patent Issued on Dec. 23 for "Heating lunch box" (Chinese Inventor)

ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,502,026, issued on Dec. 23. "Heating lunch box" was invented by Zhenfei Ou (Guangdong, China). According to the abstract* released by the U.S.... Read More

US Patent Issued to Hologic on Dec. 23 for "Breast compression and imaging systems and methods" (Connecticut, Texas Inventors)

ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,502,149, issued on Dec. 23, was assigned to Hologic Inc. (Marlborough, Mass.). "Breast compression and imaging systems and methods" was invente... Read More

US Patent Issued to Bank of America on Dec. 23 for "Enterprise application integration leveraging non-fungible token" (Indian Inventor)

ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,504,971, issued on Dec. 23, was assigned to Bank of America Corp. (Charlotte, N.C.). "Enterprise application integration leveraging non-fungibl... Read More

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