US Patent Issued to Tokyo Electron on Dec. 23 for "Substrate processing apparatus and substrate processing method" (Japanese Inventors)

ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,503,763, issued on Dec. 23, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate processing apparatus and substrate processing method" was invented by Eiichi Komori (Nagoya, Japan) and Tsuneyuki Okabe (Nagoya, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing apparatus includes a processing chamber configured to process a substrate, and a filtration part containing a porous coordination polymer and provided in an exhaust path configured to exhaust a gas from the processing chamber."

The patent was filed on Sept. 19, 2022, under Application No. 17/933,209.

*For further information, including images, charts and tables, pleas...