US Patent Issued to GlobalFoundries Singapore on Dec. 23 for "Face bonded semiconductor device with through oxide via and metal plug" (Singaporean, Malaysian Inventors)

ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,506,050, issued on Dec. 23, was assigned to GlobalFoundries Singapore Pte. Ltd. (Singapore).

"Face bonded semiconductor device with through oxide via and metal plug" was invented by Qiying Wong (Singapore), Wanbing Yi (Singapore), Yudi Setiawan (Singapore), Vel Murugan Nagalinggam (Johor Bahru, Malaysia) and Kemao Lin (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "A bonded semiconductor device includes a first semiconductor device, a second semiconductor device face bonded to the first semiconductor device, at least one metal plug in a middle of line layer of the first semiconductor device, and a through oxide via (TOV) coupled to the at leas...