ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,506,067, issued on Dec. 23, was assigned to UNITED MICROELECTRONICS CORP. (Hsin-Chu, Taiwan). "Interconnection structure" was invented by Min-S... Read More
ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,506,787, issued on Dec. 23, was assigned to Capital One Services LLC (McLean, Va.). "Systems and methods for artificial intelligence analysis o... Read More
ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,506,562, issued on Dec. 23, was assigned to BUNKER HILL TECHNOLOGIES LLC (Allen, Texas). "Method and device for relay transmission" was invente... Read More
ALEXANDRIA, Va., Dec. 23 -- United States Patent no. RE50,708, issued on Dec. 23, was assigned to LG Electronics Inc. (Seoul, South Korea). "Laundry treating apparatus" was invented by Yongwoo Kwon (... Read More
ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,504,786, issued on Dec. 23, was assigned to SHENZHEN BAIJIAYOUPU TECHNOLOGY Co. LTD. (Shenzhen, China). "Screen extender" was invented by Xiaog... Read More
ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,503,954, issued on Dec. 23, was assigned to RTX Corp. (Farmington, Conn.). "Center-tie shaft tensioning" was invented by Justin Roger DeLarm (B... Read More
ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,505,970, issued on Dec. 23, was assigned to LEVITON MANUFACTURING Co. INC. (Melville, N.Y.). "Circuit breaker including a remote on/off breaker... Read More
ALEXANDRIA, Va., Dec. 23 -- United States Patent no. D1,106,929, issued on Dec. 23, was assigned to F&V Corp. (Independence, Ohio). "Vehicle accessory base" was invented by Ryan Alan Lally Fry (Perry... Read More
ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,504,822, issued on Dec. 23, was assigned to MURATA MANUFACTURING Co. LTD. (Nagaokakyo, Japan). "Vibration device" was invented by Shozo Otera (... Read More
ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,506,040, issued on Dec. 23, was assigned to Absolics Inc. (Covington, Ga.). "Packaging substrate, semiconductor package, packaging substrate pr... Read More