US Patent Issued to SAMSUNG ELECTRONICS on Aug. 19 for "System and method for selecting 5G N3IWF server based on context-aware selection criteria" (Texas Inventor)

ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,395,848, issued on Aug. 19, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "System and method for selecting 5G N3IWF ser... Read More

US Patent Issued to SONY GROUP on Aug. 19 for "Information processing device, information processing method, terminal device, base station device, and program" (Japanese Inventor)

ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,395,894, issued on Aug. 19, was assigned to SONY GROUP Corp. (Tokyo). "Information processing device, information processing method, terminal d... Read More

US Patent Issued to SHIN-ETSU CHEMICAL on Aug. 19 for "Thermal-conductive silicone composition" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,391,860, issued on Aug. 19, was assigned to SHIN-ETSU CHEMICAL Co. LTD. (Tokyo). "Thermal-conductive silicone composition" was invented by Keit... Read More

US Patent Issued to Nokia Technologies on Aug. 19 for "Apparatus and method for sidelink discontinuous reception" (Finnish Inventors)

ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,396,012, issued on Aug. 19, was assigned to Nokia Technologies Oy (Espoo, Finland). "Apparatus and method for sidelink discontinuous reception"... Read More

US Patent Issued to SHENZHEN JIMUYIDA TECHNOLOGY on Aug. 19 for "Smart grip" (Chinese Inventors)

ALEXANDRIA, Va., Aug. 20 -- United States Patent no. D1,089,172, issued on Aug. 19, was assigned to SHENZHEN JIMUYIDA TECHNOLOGY Co. LTD (Shenzhen, China). "Smart grip" was invented by Yong Ding (She... Read More

US Patent Issued on Aug. 19 for "Food waste disposer housing" (Chinese Inventors)

ALEXANDRIA, Va., Aug. 20 -- United States Patent no. D1,088,704, issued on Aug. 19. "Food waste disposer housing" was invented by Xiongfei Gu (Nanjing, China), Zhenyu Wu (Nanjing, China) and Wei Liu ... Read More

US Patent Issued to QUALCOMM on Aug. 19 for "Interference rank indication by a victim node in full duplex" (Chinese, American Inventors)

ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,395,304, issued on Aug. 19, was assigned to QUALCOMM Inc. (San Diego). "Interference rank indication by a victim node in full duplex" was inven... Read More

US Patent Issued to INNOLUX on Aug. 19 for "Array substrate structure" (Taiwanese Inventor)

ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,396,327, issued on Aug. 19, was assigned to INNOLUX Corp. (Miao-Li County, Taiwan). "Array substrate structure" was invented by Kuan-Feng Lee (... Read More

US Patent Issued to NEWTECH GROUP on Aug. 19 for "Segmented blade module structure and molding method thereof" (Chinese Inventors)

ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,392,318, issued on Aug. 19, was assigned to NEWTECH GROUP Co. LTD. (Jiangsu, China). "Segmented blade module structure and molding method there... Read More

US Patent Issued to SHANGHAI ENNOVABIO PHARMACEUTICALS on Aug. 19 for "Five-and-six-membered heterocyclic compound and use thereof as protein receptor kinase inhibitor" (Chinese Inventors)

ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,391,687, issued on Aug. 19, was assigned to SHANGHAI ENNOVABIO PHARMACEUTICALS Co. LTD. (Shanghai). "Five-and-six-membered heterocyclic compoun... Read More

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