US Patent Issued to Wolfspeed on Aug. 26 for "Silicon carbide thermal bridge integrated on a low thermal conductivity substrate and processes implementing the same" (California, North Carolina Inventors)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,402,240, issued on Aug. 26, was assigned to Wolfspeed Inc. (Durham, N.C.). "Silicon carbide thermal bridge integrated on a low thermal conducti... Read More

US Patent Issued to InterDigital Patent Holdings on Aug. 26 for "Methods, apparatus, systems and procedures for distance dependent random access channel (RACH) preamble selection in non-terrestrial networks (NTNs)" (American, Canadian Inventors)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,402,177, issued on Aug. 26, was assigned to InterDigital Patent Holdings Inc. (Wilmington, Del.). "Methods, apparatus, systems and procedures f... Read More

US Patent Issued to VMware on Aug. 26 for "Cross cluster connectivity" (Chinese, American Inventors)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,401,625, issued on Aug. 26, was assigned to VMware LLC (Palo Alto, Calif.). "Cross cluster connectivity" was invented by Lan Luo (Beijing), Jia... Read More

US Patent Issued to ABB Schweiz on Aug. 26 for "Modular automation support system" (German Inventors)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,399,488, issued on Aug. 26, was assigned to ABB Schweiz AG (Baden, Switzerland). "Modular automation support system" was invented by Nicolai Sc... Read More

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 26 for "Method of manufacturing a semiconductor device and a semiconductor device" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,402,353, issued on Aug. 26, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Method of manufacturing a semic... Read More

US Patent Issued to TDK on Aug. 26 for "Multi-layer coil component" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,400,785, issued on Aug. 26, was assigned to TDK Corp. (Tokyo). "Multi-layer coil component" was invented by Akihiko Oide (Tokyo), Makoto Yoshin... Read More

US Patent Issued to SMALL MACHINES on Aug. 26 for "Microchip and device for quantitative analysis of antigen, and method for quantitative analysis of antigen using same" (South Korean Inventor)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,399,171, issued on Aug. 26, was assigned to SMALL MACHINES (Seoul, South Korea). "Microchip and device for quantitative analysis of antigen, an... Read More

US Patent Issued to Dexcom on Aug. 26 for "Integrated insulin delivery system with continuous glucose sensor" (California, Michigan Inventors)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,397,113, issued on Aug. 26, was assigned to Dexcom Inc. (San Diego). "Integrated insulin delivery system with continuous glucose sensor" was in... Read More

US Patent Issued to Sandisk Technologies on Aug. 26 for "Data storage device and method for host-assisted deferred defragmentation and system handling" (Indian Inventors)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,399,650, issued on Aug. 26, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.). "Data storage device and method for host-assisted def... Read More

US Patent Issued to Hitachi High-Tech on Aug. 26 for "Column connection method of liquid chromatograph, and liquid chromatograph" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,399,160, issued on Aug. 26, was assigned to Hitachi High-Tech Corp. (Tokyo). "Column connection method of liquid chromatograph, and liquid chro... Read More

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