INTERNATIONAL PATENT: NIKKISO CO., LTD., 日機装株式会社 FILES APPLICATION FOR "MOTOR BEARING WEAR MONITORING DEVICE, DISCONNECTION DETECTION PROGRAM, DISCONNECTION ESTIMATION PROGRAM AND DISCONNECTION DETECTION METHOD"

GENEVA, Sept. 16 -- NIKKISO CO., LTD. (20-3, Ebisu 4-Chome, Shibuya-ku, Tokyo1506022), 日機装株式会社 (東京都渋谷区&#24693... Read More

INTERNATIONAL PATENT: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., パナソニックＩＰマネジメント株式会社 FILES APPLICATION FOR "PRESSURE SENSOR AND PRESSURE DETECTION DEVICE"

GENEVA, Sept. 16 -- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (22-6, Moto-machi, Kadoma-shi, Osaka5710057), パナソニックＩＰマネ&... Read More

INTERNATIONAL PATENT: NEC CORPORATION, 日本電気株式会社 FILES APPLICATION FOR "MEASURE GENERATION SYSTEM, MEASURE GENERATION METHOD AND MEASURE GENERATION PROGRAM"

GENEVA, Sept. 16 -- NEC CORPORATION (7-1, Shiba 5-chome, Minato-ku, Tokyo1088001), 日本電気株式会社 (東京都港区芝&#2... Read More

INTERNATIONAL PATENT: THE UNIVERSITY OF TOKYO, 国立大学法人　東京大学 FILES APPLICATION FOR "SIGNAL PROCESSING CIRCUIT, SEMICONDUCTOR PIXEL DETECTOR, INFORMATION PROCESSING METHOD, PROGRAM, INFORMATION PROCESSING DEVICE, INFORMATION PROCESSING SYSTEM AND DEVICE"

GENEVA, Sept. 16 -- THE UNIVERSITY OF TOKYO (3-1, Hongo 7-chome, Bunkyo-ku, Tokyo1138654), 国立大学法人　東京大学 (東京&#3... Read More

INTERNATIONAL PATENT: JFE STEEL CORPORATION, ＪＦＥスチール株式会社 FILES APPLICATION FOR "BLAST FURNACE OPERATION METHOD AND BLAST FURNACE AUXILIARY FACILITY"

GENEVA, Sept. 16 -- JFE STEEL CORPORATION (2-3, Uchisaiwai-cho 2-chome, Chiyoda-ku, Tokyo1000011), ＪＦＥスチール株式会社 (東&#2... Read More

INTERNATIONAL PATENT: BONDTECH CO., LTD., ボンドテック株式会社 FILES APPLICATION FOR "PARTICLE BEAM SOURCE, BONDING SYSTEM AND BONDING METHOD"

GENEVA, Sept. 16 -- BONDTECH CO., LTD. (25, Kisshoin-Miyanohigashi-cho, Minami-ku, Kyoto-shi, Kyoto6018305), ボンドテック株式会社 (京&... Read More

INTERNATIONAL PATENT: NITTO DENKO CORPORATION, 日東電工株式会社 FILES APPLICATION FOR "RETARDATION FILM MANUFACTURING METHOD"

GENEVA, Sept. 16 -- NITTO DENKO CORPORATION (1-1-2, Shimohozumi, Ibaraki-shi, Osaka5678680), 日東電工株式会社 (大阪府茨木&... Read More

INTERNATIONAL PATENT: NAMICS CORPORATION, ナミックス株式会社 FILES APPLICATION FOR "FILM FOR ADHESIVE LAYER, WIRING BOARD, MULTILAYER WIRING BOARD AND SEMICONDUCTOR DEVICE"

GENEVA, Sept. 16 -- NAMICS CORPORATION (3993, Nigorikawa, Kita-ku, Niigata-shi, Niigata9503131), ナミックス株式会社 (新潟県&#260... Read More

INTERNATIONAL PATENT: MURATA MANUFACTURING CO., LTD., 株式会社村田製作所 FILES APPLICATION FOR "POROUS STRUCTURE"

GENEVA, Sept. 16 -- MURATA MANUFACTURING CO., LTD. (10-1, Higashikotari 1-chome, Nagaokakyo-shi, Kyoto6178555), 株式会社村田製作所 (京&#3711... Read More

INTERNATIONAL PATENT: KOMATSU LTD., 株式会社小松製作所 FILES APPLICATION FOR "SYSTEM INCLUDING WORK MACHINE, WORK MACHINE AND AUTOMATIC CONTROL METHOD FOR WORK MACHINE"

GENEVA, Sept. 16 -- KOMATSU LTD. (1-2-20, Kaigan, Minato-ku, Tokyo1058316), 株式会社小松製作所 (東京都港区海&#... Read More

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