US Patent Issued to NXP on Nov. 25 for "Systems and methods for testing electrical connections between a chip and external circuitry" (Dutch Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,481,007, issued on Nov. 25, was assigned to NXP B.V. (Eindhoven, Netherlands).

"Systems and methods for testing electrical connections between a chip and external circuitry" was invented by Erwin Johannes Gerardus Janssen (Meijel, Netherlands) and Tarik Saric (Eindhoven, Netherlands).

According to the abstract* released by the U.S. Patent & Trademark Office: "Systems and methods for testing electrical connections between a chip and external circuitry are discussed. In some embodiments, a chip may include an Input/Output (I/O) terminal and a test circuit coupled to the I/O terminal, wherein an oscillating frequency of the test circuit changes in response to an impedance change at the ...