Japan, Jan. 16 -- HOYA CORP has got intellectual property rights for 'SUBSTRATE FOR IMPRINT MOLD, BLANK FOR IMPRINT MOLD, IMPRINT MOLD, METHOD FOR MANUFACTURING IMPRINT MOLD, METHOD FOR MANUFACTURING ... Read More
Japan, Jan. 16 -- OJI HOLDINGS CORP has got intellectual property rights for 'SOIL IMPROVEMENT METHOD, SOIL IMPROVEMENT SYSTEM, ABSORBENT ARTICLE, AND SOIL IMPROVEMENT AGENT.' Other related details ar... Read More
Japan, Jan. 16 -- SHIMADZU CORP has got intellectual property rights for 'ANALYSIS METHOD USING SPECTRUM MEASUREMENT DEVICE.' Other related details are as follows: Application Number: JP,2022-035858 ... Read More
Japan, Jan. 16 -- NIPPON STEEL STAINLESS STEEL CORP has got intellectual property rights for 'STAINLESS STEEL MATERIAL, SPOT WELDING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME.' Other related det... Read More
Japan, Jan. 16 -- SUMITOMO ELECTRIC IND LTD has got intellectual property rights for 'WAFER HOLDER AND SUPPORT PIN FOR WAFER HOLDER.' Other related details are as follows: Application Number: JP,2022... Read More
Japan, Jan. 16 -- DAINIPPON PRINTING CO LTD has got intellectual property rights for 'THERMAL TRANSFER PRINTER AND METHOD FOR MANUFACTURING PRINTED MATTER.' Other related details are as follows: Appl... Read More
Japan, Jan. 16 -- TOKYO ELECTRON LTD has got intellectual property rights for 'PROCESSING LIQUID SUPPLY DEVICE AND PROCESSING LIQUID SUPPLY METHOD.' Other related details are as follows: Application ... Read More
Japan, Jan. 16 -- FUJIFILM BUSINESS INNOVATION CORP has got intellectual property rights for 'CARRIER FOR ELECTROSTATIC CHARGE IMAGE DEVELOPMENT AND METHOD FOR MANUFACTURING THE SAME, ELECTROSTATIC CH... Read More
Japan, Jan. 16 -- DUSA PHARMACEUTICALS INC has got intellectual property rights for 'TOPICAL COMPOSITION FOR PHOTODYNAMIC THERAPY, OBSTRUCTIVE DRESSING MATERIAL, KIT USING THE SAME, MATERIAL FOR PHOTO... Read More
Japan, Jan. 16 -- FUJI ELECTRIC CO LTD has got intellectual property rights for 'SEMICONDUCTOR DEVICE.' Other related details are as follows: Application Number: JP,2022-034832 Category (FI): H01L29... Read More