ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,528,202, issued on Jan. 20, was assigned to Toyota Research Institute Inc. (Los Altos, Calif.). "Collapsible splined fingers for ratcheting eng... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,527,318, issued on Jan. 20, was assigned to TMRW Life Sciences Inc. (New York). "Systems, apparatus and methods to pick and/or place specimen c... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,527,324, issued on Jan. 20, was assigned to ADAMA MAKHTESHIM LTD. (Beer Sheva, Israel). "5-fluoro-4-imino-3-(alkyl/substituted alkyl)-1-(arylsu... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,528,534, issued on Jan. 20, was assigned to NSK LTD. (Tokyo). "Steering device" was invented by Yoshifumi Kurokawa (Ann Arbor, Mich.). Accordi... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,527,301, issued on Jan. 20, was assigned to RentAcoop LLC (Germantown, Md.). "Modular and collapsible housing system for young poultry" was inv... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,529,984, issued on Jan. 20, was assigned to RICOH COMPANY LTD. (Tokyo). "Heating device, fixing device, and image forming apparatus" was invent... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,529,596, issued on Jan. 20. "Wireless sensor with embedded solar panel and interior light detector" was invented by E. Strode Pennebaker III (H... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,530,959, issued on Jan. 20, was assigned to Honeywell International Inc. (Charlotte, N.C.). "Predictive analytics of fire systems to reduce unp... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,530,802, issued on Jan. 20, was assigned to RivalShot Corp. (Atherton, Calif.). "Automated image aberration identification system and method" w... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,754, issued on Jan. 20, was assigned to SK hynix Inc. (Icheon-si, South Korea). "Semiconductor device having wafer-to-wafer bonding structu... Read More