ALEXANDRIA, Va., March 19 -- United States Patent no. 12,252,329, issued on March 18, was assigned to Kimberly-Clark Worldwide Inc. (Neenah, Wis.). "Flexible polymer packaging with increased rigidity... Read More
ALEXANDRIA, Va., March 19 -- United States Patent no. 12,254,989, issued on March 18, was assigned to PREH Holding LLC (Laguna Niguel, Calif.). "Connected body surface care module" was invented by Th... Read More
ALEXANDRIA, Va., March 19 -- United States Patent no. 12,253,790, issued on March 18, was assigned to YUEQING ORIGINALITY PHOTOGRAPHY EQUIPMENT Co. LTD. (Yueqing, China). "Quick-locking softbox chuck... Read More
ALEXANDRIA, Va., March 19 -- United States Patent no. 12,252,654, issued on March 18, was assigned to ExxonMobil Technology and Engineering Co. (Spring, Texas). "Integrated biomass gasification and e... Read More
ALEXANDRIA, Va., March 19 -- United States Patent no. D1,067,117, issued on March 18. "Ratchet buckle" was invented by Qiyong Peng (Jiangxi, China). The patent was filed on March 28, 2023, under App... Read More
ALEXANDRIA, Va., March 19 -- United States Patent no. D1,066,947, issued on March 18, was assigned to Whitmor Inc. (Southaven, Miss.). "Hanging organizer" was invented by Sandy Felsenthal (Memphis, T... Read More
ALEXANDRIA, Va., March 19 -- United States Patent no. D1,067,024, issued on March 18. "Height adjustable support for joist" was invented by Alan Sian Ghee Lee (Singapore), Henry Greaves (Watsons Bay,... Read More
ALEXANDRIA, Va., March 19 -- United States Patent no. 12,256,538, issued on March 18, was assigned to CHANGXIN MEMORY TECHNOLOGIES INC. (Anhui, China). "Anti-fuse unit structure and anti-fuse array" ... Read More
ALEXANDRIA, Va., March 19 -- United States Patent no. 12,256,057, issued on March 18, was assigned to ResMed Asia Pte. Ltd. (Singapore). "Positioning, stabilising, and interfacing structures and syst... Read More
ALEXANDRIA, Va., March 19 -- United States Patent no. 12,255,183, issued on March 18, was assigned to SK hynix Inc. (Icheon-si, Japan). "Semiconductor package including heat dissipation layer" was in... Read More