India, Jan. 28 -- Union Minister Ashwini Vaishnaw has stated that the Indian goverment is now aiming to produce 3nm semiconductor chips in India by 2032.
Vaishnaw said: "The target by 2032 is to reach 3-nanometre chip manufacturing and design. Design, of course, we are doing even today. But, in manufacturing, we should reach 3-nanometre."
He said the government will focus on six categories of chips under the second phase of the Design-Linked Incentive (DLI) scheme. These areas include: compute, radio frequency (RF), networking, power, sensor, and memory chips. The initiative is designed to enable companies in India to gain major control over developing 70-75%of technology products. He added, "We will encourage academia and industry to c...
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