India, Sept. 5 -- From 2024 to 2025, the advanced packaging market reinforced its strategic role across markets. Once confined to specific high-end applications, it is now a pillar of mass adoption in consumer electronics and an enabler of emerging markets, including AR/VR, edge AI, aerospace, and defense.

At the same time, the telecom and infrastructure segment is experiencing unprecedented growth, with a 14.9% increase between 2024 and 2030, making it the segment with the highest growth. This momentum is powered by AI accelerators, GPUs, cloud and data center demand, and chiplet-based architectures.

As system complexity rises, advanced packaging technologies such as CoWoS, SoIC, EMIB, I-Cube, and 3D stacking provide the performance a...