US Patent Issued to KYOCERA Document Solutions on April 29 for "Manual bypass tray having opening for accommodating projection sticking out from side face of image forming apparatus main body, and image forming apparatus" (Japanese Inventor)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,286,321, issued on April 29, was assigned to KYOCERA Document Solutions Inc. (Osaka, Japan). "Manual bypass tray having opening for accommodatin... Read More

US Patent Issued to Synthomer on April 29 for "Compositions and processes for providing release coatings" (Ohio Inventor)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,286,570, issued on April 29, was assigned to Synthomer Inc. (Beachwood, Ohio). "Compositions and processes for providing release coatings" was i... Read More

US Patent Issued to Synthomer on April 29 for "Compositions and processes for providing release coatings" (Ohio Inventor)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,286,570, issued on April 29, was assigned to Synthomer Inc. (Beachwood, Ohio). "Compositions and processes for providing release coatings" was i... Read More

US Patent Issued to Fulterer on April 29 for "Pull-out guide" (Austrian Inventor)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,285,105, issued on April 29, was assigned to Fulterer AG & Co KG (Lustenau, Austria). "Pull-out guide" was invented by Bernhard Ill (Hohenweiler... Read More

US Patent Issued to Fulterer on April 29 for "Pull-out guide" (Austrian Inventor)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,285,105, issued on April 29, was assigned to Fulterer AG & Co KG (Lustenau, Austria). "Pull-out guide" was invented by Bernhard Ill (Hohenweiler... Read More

US Patent Issued to LG CHEM on April 29 for "Adhesive composition for semiconductor circuit connection, adhesive film for semiconductor, method for manufacturing semiconductor package, and semiconductor package using the same" (South Korean Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,286,564, issued on April 29, was assigned to LG CHEM Ltd. (Seoul, South Korea). "Adhesive composition for semiconductor circuit connection, adhe... Read More

US Patent Issued to LG CHEM on April 29 for "Adhesive composition for semiconductor circuit connection, adhesive film for semiconductor, method for manufacturing semiconductor package, and semiconductor package using the same" (South Korean Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,286,564, issued on April 29, was assigned to LG CHEM Ltd. (Seoul, South Korea). "Adhesive composition for semiconductor circuit connection, adhe... Read More

US Patent Issued to Takeda Pharmaceutical on April 29 for "Treatment with anti-Alpha4Beta7 antibody" (American, British Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,286,479, issued on April 29, was assigned to Takeda Pharmaceutical Co. Ltd. (Osaka, Japan). "Treatment with anti-Alpha4Beta7 antibody" was inven... Read More

US Patent Issued to Takeda Pharmaceutical on April 29 for "Treatment with anti-Alpha4Beta7 antibody" (American, British Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,286,479, issued on April 29, was assigned to Takeda Pharmaceutical Co. Ltd. (Osaka, Japan). "Treatment with anti-Alpha4Beta7 antibody" was inven... Read More

US Patent Issued to TATA STEEL NEDERLAND TECHNOLOGY on April 29 for "High strength steel product and a process to produce a high strength steel product" (Dutch Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,286,682, issued on April 29, was assigned to TATA STEEL NEDERLAND TECHNOLOGY B.V. (Velsen-Noord, Netherlands). "High strength steel product and ... Read More

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