US Patent Issued to Beijing BOE Technology Development on Dec. 9 for "Packaging structure, fabrication method thereof, and display apparatus" (Chinese Inventors)

ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,495,703, issued on Dec. 9, was assigned to Beijing BOE Technology Development Co. Ltd. (Beijing).

"Packaging structure, fabrication method thereof, and display apparatus" was invented by Che An (Beijing), Wenqi Liu (Beijing), Zhongyuan Sun (Beijing) and Wei Huang (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed are a packaging structure, a fabrication method thereof, and a display apparatus. The packaging structure includes: a first base; a packaging body on the first base; and a first packaging layer on a side of the packaging body away from the first base and including at least two inorganic layers sequentially stacked, wherein the at ...