ALEXANDRIA, Va., July 3 -- United States Patent no. 12,346,078, issued on July 1, was assigned to Solaredge Technologies Ltd. (Herzeliya, Israel). "Communication protocol for distributed energy manag... Read More
ALEXANDRIA, Va., July 3 -- United States Patent no. 12,344,252, issued on July 1, was assigned to Hyundai Motor Co. (Seoul, South Korea) and Kia Corp. (Seoul, South Korea). "Method of controlling tow... Read More
ALEXANDRIA, Va., July 3 -- United States Patent no. D1,081,374, issued on July 1, was assigned to The Coca-Cola Co. (Atlanta). "Surface pattern applied to a bottle" was invented by Noah Wigington (At... Read More
ALEXANDRIA, Va., July 3 -- United States Patent no. 12,345,503, issued on July 1, was assigned to Syswit Optoelectronics Technology Co. Ltd. (Guangzhou, China). "Automatic light-adjusting structure f... Read More
ALEXANDRIA, Va., July 3 -- United States Patent no. 12,348,207, issued on July 1, was assigned to KEYSIGHT TECHNOLOGIES INC. (Santa Rosa, Calif.). "Wideband termination network" was invented by Danie... Read More
ALEXANDRIA, Va., July 3 -- United States Patent no. D1,081,588, issued on July 1, was assigned to Molex LLC (Lisle, Ill.). "Electrical connector" was invented by Satoshi Tanaka (Yamato, Japan). The ... Read More
ALEXANDRIA, Va., July 3 -- United States Patent no. 12,347,610, issued on July 1. "Inductive coupler for downhole transmission line" was invented by Joe Fox (Spanish Fork, Utah). According to the ab... Read More
ALEXANDRIA, Va., July 3 -- United States Patent no. 12,349,287, issued on July 1, was assigned to Pac Tech-Packaging Technologies GmbH (Nauen, Germany). "Method for soldering an electronic component ... Read More
ALEXANDRIA, Va., July 3 -- United States Patent no. 12,348,346, issued on July 1, was assigned to QUALCOMM Inc. (San Diego). "Flexible guard length interval" was invented by Hemant Saggar (San Diego)... Read More
ALEXANDRIA, Va., July 3 -- United States Patent no. 12,347,810, issued on July 1, was assigned to Western Digital Technologies Inc. (San Jose, Calif.). "Semiconductor device package die stacking syst... Read More