US Patent Issued to THE JAPAN STEEL WORKS on Jan. 13 for "Molding method" (Japanese Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,521,924, issued on Jan. 13, was assigned to THE JAPAN STEEL WORKS LTD. (Tokyo). "Molding method" was invented by Takayuki Hirano (Tokyo), Kazum... Read More

US Patent Issued to Wyvern Pharmaceuticals on Jan. 13 for "Composition for regulating production of interfering ribonucleic acid" (Canadian Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,522,835, issued on Jan. 13, was assigned to Wyvern Pharmaceuticals Inc. (Calgary, Canada). "Composition for regulating production of interferin... Read More

US Patent Issued to Connie Michele Nerio on Jan. 13 for "Apparatus, systems, and methods of a multi-use cosmetic pen with blotting paper dispenser" (New York Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,520,928, issued on Jan. 13, was assigned to Connie Michele Nerio (New York). "Apparatus, systems, and methods of a multi-use cosmetic pen with ... Read More

US Patent Issued to Huawei Technologies'Co., 'Ltd.' on Jan. 13 for "Method for sending demodulation reference signal, method for receiving demodulation reference signal, and communication apparatus" (Chinese, French Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,526,112, issued on Jan. 13, was assigned to Huawei Technologies'Co.'Ltd.' (Shenzhen, China). "Method for sending demodulation reference signal,... Read More

US Patent Issued to Stryker on Jan. 13 for "Methods and systems for adaptive imaging for low light signal enhancement in medical visualization" (Canadian Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,340, issued on Jan. 13, was assigned to Stryker Corp. (Portage, Mich.). "Methods and systems for adaptive imaging for low light signal enha... Read More

US Patent Issued to Sumitomo Electric Device Innovations on Jan. 13 for "Semiconductor device, package for semiconductor device, and method for manufacturing package for semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,510, issued on Jan. 13, was assigned to Sumitomo Electric Device Innovations Inc. (Yokohama, Japan). "Semiconductor device, package for sem... Read More

US Patent Issued to BIEDERMANN TECHNOLOGIES on Jan. 13 for "Bone anchoring device" (German Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,521,151, issued on Jan. 13, was assigned to BIEDERMANN TECHNOLOGIES GMBH & Co. KG (Donaueschingen, Germany). "Bone anchoring device" was invent... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on Jan. 13 for "Method of forming source/drain epitaxial stacks" (Taiwanese Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,527,041, issued on Jan. 13, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Method of forming source/drain epit... Read More

US Patent Issued to Capital One Services on Jan. 13 for "Network of trust for bill splitting" (District Of Columbia, Virginia, New Jersey Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,524,755, issued on Jan. 13, was assigned to Capital One Services LLC (McLean, Va.). "Network of trust for bill splitting" was invented by Adam ... Read More

US Patent Issued to GE Vernova Infrastructure Technology on Jan. 13 for "Flash-atomizing ammonia in a gas turbine combustor" (Swiss, Indian Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,523,171, issued on Jan. 13, was assigned to GE Vernova Infrastructure Technology LLC (Greenville, S.C.). "Flash-atomizing ammonia in a gas turb... Read More

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