US Patent Issued to Sumitomo Electric Device Innovations on Jan. 13 for "Semiconductor device, package for semiconductor device, and method for manufacturing package for semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,510, issued on Jan. 13, was assigned to Sumitomo Electric Device Innovations Inc. (Yokohama, Japan).

"Semiconductor device, package for semiconductor device, and method for manufacturing package for semiconductor device" was invented by Shingo Inoue (Yokohama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package for a semiconductor device includes a metal base plate, a wall portion, a first metal film, and a lead portion. The base plate has a first region and a second region surrounding the first region. The wall portion has a first frame body comprising metal and a second frame body comprising resin. The first frame body is provided on th...